The superior quality of GeneSiC Semiconductor’s power products is a result of an industry leading technology and high quality of materials that go in to them. For the scope of compliance declaration, GeneSiC Semiconductor classifies its silicon carbide (SiC) products in terms of the product’s industry standard assembly package – DO-214 (SMB), TO-252, TO-263, TO-220, TO-247, TO-46 and SOT-227
The assembly package specific compliance documents can be obtained by clicking the relevant assembly package links on this page
GeneSiC Semiconductor takes very seriously the worldwide concerns that metals mined in the conflict areas of the Democratic Republic of the Congo (DRC).
For GeneSiC’s Conflict Free Sourcing Statement, please click the appropriate package above.
GeneSiC Semiconductor is supportive of the scope and direction of REACH which is to promote and progress the protection of human health and the environment through careful examination of the properties of chemical substances in our products
For GeneSiC’s REACH Compliance Statement, please click the appropriate package above
GeneSiC Semiconductor is devoted to supply information about the substances in its products as required and will be quick to respond to future environmental directives to be certain we can support our customer requirements.
For GeneSiC’s ROHS Compliance Statement, please click the appropriate package above.
GeneSiC Semiconductor is committed to supply Halogen Free parts to promote and progress the protection of human health and the environment through careful examination of the properties of chemical substances.
For GeneSiC’s Halogen-free Status Statement, please click appropriate package above.
Tin Whisker Report for DO-214, TO-252, TO-220 and TO-247 packaged parts
GeneSiC’s DO-214, TO-252, TO-220, TO-247 packaged parts meet the highest standards of Tin-Whisker avoidance.
For GeneSiC’s Tin Whisker Report, please click appropriate package above.